Three-Dimensional Integrated Imaging Device
Making the pixels smaller by improving signal processing circuits
We are researching a three-dimensional integrated imaging device with the aim of implementing an image sensor with many pixels and a high-frame-frequency that can be used in the future for purposes such as 3D imaging. Here, we introduce our latest 320×240 pixel, two-layer structure prototype.
- A signal processing circuit for each pixel
- The signal processing circuit of each pixel is three-dimensionally integrated underneath the photodetector by stacking and interconnecting individual substrates. This facilitates parallel processing of the signals in each pixel so that devices with more pixels and a higher frame frequency can be developed in the future.
- Making the pixels smaller
- By reducing the size of the buried electrodes that connect the photodetectors and signal processing circuits, and by adjusting the circuit layout of the pixels, we have managed to shrink the pixels from the previous size of approximately 80 × 80 µm² to approximately 50 × 50 µm².
To further promote the miniaturization of pixels, we will work on introducing a multilayer structure to the signal processing circuit through a combination of circuit design and process development.
- This research is jointly being conducted with the University of Tokyo.