Future Image Sensor Technologies
Revolutionizing broadcast cameras
We are refining our imaging devices to improve current 8K Super Hi-Vision cameras and help develop future three-dimensional cameras. This exhibit introduces our latest achievements in imaging devices.
- Back-illuminated small-size image sensor
- We have prototyped a novel image sensor for 8K Super Hi-Vision with 33 million pixels of size 1.1μm. The sensor size is equivalent to 2/3 optical inch and the back-illuminated pixel structure contributes to its sensitivity and speed. Newly developed high-speed A/D conversion circuits are integrated, enabling a high frame rate of 240 Hz.
- Pixel-parallel processing three-dimensional integrated imaging device
- The signal processing circuit for each pixel is arranged just beneath the photodetector, allowing every pixel to output simultaneously. This means we can increase the pixel count and still achieve a high frame rate. We have demonstrated its validity with our latest 128 × 96-pixel prototype.
- Solid-state image sensor overlaid with photoelectric conversion layer and organic image sensor (Poster Exhibits E-P1, P2)
- Photodetectors convert light into electrical signals and are usually made from silicon. We believe that substituting silicon with selenium, a compound semiconductor, or an organic material will improve the sensitivity or color separation performance of image sensors. The poster exhibits explain our latest achievements.
We will continue to pursue a wide range of research, from fundamental technology to device development, in an attempt to dramatically improve broadcast cameras.
- The research on back-illuminated small-size image sensors is jointly being conducted with Shizuoka University.
- The research on pixel-parallel processing three-dimensional integrated imaging devices is jointly being conducted with the University of Tokyo.
- The research on organic image sensors is jointly being conducted with Kochi University of Technology.